Once again, the PCIM Europe Conference offers a multi-faceted program on key developments in power electronics consisting of lecture and poster presentations, keynotes, special sessions and exclusive seminars and tutorials. Current research is focused on the applications of wide bandgap (WBG) technologies, from chip development, through robust cell design, to packaging and interconnection technologies – including new materials for heat dissipation with simultaneous modification of the thermal expansion coefficients and a low-inductance packaging design with extremely high power densities. It is clear by now that a high technical level has also been reached in silicon carbide (SiC) and gallium nitride (GaN) devices, which makes it possible to create reliable, interference-free power electronic converters that confer tremendous advantages in systems.
A major part of the PCIM Europe Conference 2020 will be dedicated to the latest innovations, in particular those relating to device robustness and service life, system reliability with increased efficiency and higher power densities, and excellent stationary and dynamic behavior – including overload and short-circuit behavior. New materials and integrated cooling concepts for future packaging designs with extremely low leakage inductance and distributed capacities to control small chips and ultra-fast switching will be discussed. Experts from science and industry will discuss innovations for new materials that combine good heat dissipation with excellent insulating properties and modified thermal expansion coefficients to improve device reliability and extend service life. Innovative system solutions for power electronic converters with intelligent control concepts for managing high di/dt and du/dt values will also be on show.
A further highlight will be system designs for energy converters – DC/DC and DC/AC applications – at frequencies from 10 kHz to 100 kHz with low-inductance power modules consisting of new chip bond technologies for extended temperature ranges, and multi-ceramic substrate materials with integrated cooling for chips with high power density and extremely fast switching operations. A major goal of these “power electronic building blocks” is to achieve significantly higher load cycles. Especially when using SiC components , important questions arise regarding possible lead applications, technical system advantages, and their intersection with economic efficiency. However, it is also important to note that despite the availability of WBG technologies, advances continue to be made in silicon components. New developments in silicon components bring benefits in many fields of power electronic system technology, especially in terms of very high system reliability, component service life, and system costs. Silicon components will continue to dominate the mass market for the next two decades.
Interested participants can also obtain comprehensive information about the intelligent management of energy storage systems. Special attention will be given to discussing and evaluating system-relevant electrical functions, sensors for monitoring the state of charge and aging of individual battery cells, and optimized charging strategies designed to extend battery life. For the first time, the PCIM Europe Conference will offer a special session on the additive manufacturing of components. These 3D-printed components are used, among other things, as integrated heat sinks in the automotive industry.
Once again this year, the PCIM Europe Conference features outstanding expert presentations on key developments in power electronics. New technologies will be introduced to the market and innovative solutions discussed in public for the first time.
- Power supply systems
- Power quality
- Energy storage
- Electrical drives
- Power semiconductor devices
- Passive components