With JEAN-151®, we offer a robust solder paste flux as a versatile all-rounder for a wide range of challenges from consumer to industrial and automotive applications.

The halide-free JEAN-151® is classified as ROL0 according to J-STD-004A and is the only solder paste flux available with the new, particularly reliable alloy SN100CV®. It is also the first solder paste to cover the entire process chain from powder size type 3 to powder size type 5 in the alloy SAC305.

Now available in 10 different alloys, JEAN-151® is characterized above all by its long shelf life of 12 months when stored in a refrigerator. In combination with SAC305 type 3 and type 4, JEAN-151® can even be kept for at least 12 months at temperatures below 25°C.

StarCore®: The new Star(Core®) in solder wire heaven

Due to high soldering tip temperatures and feeding speeds, lead-free alloys can lead to flux spattering.

Temperature differences between the solder alloy, the boiling point of the solvents and the melting temperature of the resins can lead to high vapor pressures and core temperatures inside the flux core, which can damage the flux and its activation.

Thanks to a special shape of the flux core, BALVER ZINN was able to make the tube wall thinner in some places, which means that the solder melts faster in these areas and less vapor pressure forms inside. StarCore® was born!

StarCore234-E® is available with standard alloys SN100C® and SAC305.

Starting with REGI-RED®: An alcohol-based flux specially developed for wave soldering, which can also be used in all common processes.

REGI-RED® is based on organic acids, is classified as ORL0 and is particularly temperature-stable.

Like almost all fluxes in the REGI series, REGI-RED® is particularly suitable for use on overlaid printed circuit boards or assemblies that have undergone / must undergo multiple soldering processes.

As REGI-BLUE® is demonstrably one of the safest water-based fluxes on the market, there are no major obstacles to its use in the automotive sector.

REGI-BLUE® does not leave the typical residues on the contact surfaces of the PCB, especially when soldering with solder frames.

REGI-GREEN® is based on REGI-RED®, contains 30% water and is also classified as ORL0. The boiling temperature of REGI-GREEN® is slightly (3 - 4°C) higher than that of a purely alcohol-based flux, so the change can be made without process adjustment.

The newest member of the REGI series is REGI-GOLD®, which is based on natural resins and therefore classified as ROL0. REGI-GOLD® is designed to encapsulate any residual activators with the resins and thus leave even safer residues.