Power semiconductor packaging is one of Semikron Danfoss’ core competencies. Since the invention of the world’s first electrically isolated power semiconductor module - SEMIPACK - in 1975, our portfolio of technologies has grown considerably. Our innovations in die attach, layout, housing design, and cooling further advance reliability and effciency in power electronic systems.

SEMIPACK 1 – 6th Generation

• ITAV/IFAV up to 145A and ITSM/IFSM up to 2210A
• Optimized baseplate for improved heat sink contact
• Up to 50% lower Rth

SEMIPACK 2 Performance

• Latest generation of diode and thyristor chips
• Operation temperatures of up to 150°C
• Unrivaled power density in 34mm module