Advanced Power Modules for Automotive Traction Applications

Continuous improvements on power density, scalability, efficiency and costs - these are the main attributes passenger car manufacturers are requiring for e-drive power electronics.Silicon Carbide (SiC) is the established chip technology showing year by year significant power density improvements on which power module technology needs to adopt to.Semikron Danfoss is leveraging these chip technology improvements for its power module portfolio by continuously evolving packaging technology by improving thermal & electrical designs, scalability, functional integration and system topologies.The presentation covers the related key attributes and gives an overview of Semikron Danfoss automotive power module technologies and the portfolio evolution addressing it.