Si3N4-AMB substrates with integrated spacers are used for power modules with cooling on both sides, also known as "dual-side cooling" (DSC). With this construction technique, very effective heat dissipation can be achieved, thereby significantly increasing the reliability of SiC and GaN semiconductors.

To meet the challenges of the next generation of power modules with ever higher junction temperatures, we offer you Si3N4 AMB substrates with an integrated heat sink featuring up to 2mm thickness of copper on the circuit layer.

AMOTECH, a 30-year-old material technology company, specializes in highly reliable MLCCs with large capacitance, high voltage, broadband, and high-Q for various power electronics, including EV power systems.