Submicron 3D X-ray for Advanced Packaging.

Now available as a fully-automated inspection solution for Advanced Packaging, the CA20 is designed to deliver superior 2D & 3D images in the highest resolution. It allows the fastest inspection of micron-sized details, identifying structural defects fast – and helps cut time to market for complex 3D ICs.

CA20 Highlights

• Designed for the semiconductor industry
• Available with fully automated operation for seamless integration into your fab
• AI-based data analysis and advanced software ensures fast, accurate defect recognition to resolve systematic issues and maximize yield
• Non-destructive technology for three-dimensional insights into solder bumps within minutes
• Repeatable results through reliable and accurate technology, designed to support a stable inspection routine
• Dose Manager for the protection of X-ray sensitive components