E-LIT – Lock-In Thermography for electronics is an automated testing solution system (as part of NDT techniques) which allows non-contact (electrical) failure analysis of semiconductor material during the manufacturing process. Inhomogeneous temperature distribution, local power loss, leakage currents, resistive vias, cold joints, latch-up effects and soldering issues can be measured with Lock-in Thermography. This is achieved by using the shortest measurement times combined with a high-performance thermographic camera and a specialised lock-in procedure.

The power supply for this process is clocked with a synchronization module and failures that produce mK or even μK temperature differences are reliably detected by the Lock-in Thermography system.

Smallest defects at electronic components like point and line shunts, issues from overheating, internal (ohmic) shorts, oxide defects, transistor and diode failures on a PCB surface, in integrated circuits (IC´s), LED modules and battery cells can be detected and displayed in x and y positions. Additionally, it is possible to analyse stacked-die packages or multi-chip modules in z-direction with merely changing the lock-in frequency.

The powerful Lock-in Thermography software uses the latest algorithms and routines from most recent scientific publications.

E-LIT is extremely powerful also in resolving smallest geometrical structures as it can be equipped with strong microscopic lenses and additional SIL lenses. Identifying smallest structures with InfraTec´s E-LIT does not mean that the resulting field of view will also be smallest – implementing thermal cameras with detector sizes of up to (1,920 x 1,536) pixels provide large scale microscopic imaging. For even larger imaging stitching options are available.

𝗕𝗲𝗻𝗲­𝗳𝗶𝘁𝘀 𝗼𝗳 𝘁𝗵𝗲 𝗠𝗼𝗱𝘂𝗹𝗮𝗿 𝗧𝗲𝘀𝘁 𝗕𝗲𝗻𝗰𝗵

Measurement with one workstation - from the entire circuit board to the smallest detail.

• Customised modular measuring station, e. g. with X-Y table and Z-axis manually or motorised adjustable, for positioning and individual adjustment of the working distances, depending on the size of the measured object

• Flexibility through variable components, e.g. different optics, holding devices for the test specimen or contacting options

• Online lock-in measurement with the highest sensitivity

• Complete and detailed microscopy analysis

• Geometrical resolution up to 1.3 μm per pixel with microscope lenses

• Thermal resolution in the microkelvin range

• High-voltage test station with mandatory contact protection and operating status indicator light

• Integration of high-voltage source meter unit up to 3kV

• integrated IV curve tracer for i-v characterization

• Multi-layer analysis

• Automatic scanning of larger samples due to precision mechanics

https://www.infratec.eu/thermography/non-destructive-testing/e-lit/