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Insulated Metal Substrates (IMS)
Beschreibung
New highlight! High thermal performance IMS (DA-15):
- Copper base and solid construction
- As baseplate is integrated into IMS, switching from Alumina DBC eliminates soldering the substrate onto the baseplate (production cost reduction/ optimization of manufacture process)
- High thermal conductivity (15 W/mK) and heat dissipation
- Configuration and combination
IMS grades for different requirement based on high heat cycling reliability/ maximum operating temperature/ and thermal conductivity
- Flexible insulating layer reduces stress on solder and reduces risk of solder cracks
- Thermal conductivity range: 1.7 - 4.3 W/mK
- We welcome to discuss per reqeust
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