Referenten:
Tobias Holz, Market Development Manager, Rogers Germany
SiC power semiconductors are driving power density and switching frequency into new levels – pushing cooling to the physical limits of conventional modules. A new concept from Rogers, the curamik® DirectCool solution, integrates the Micro Channel Cooler directly into the substrate and bonds it to the ceramic already during the manufacturing process. This shortens the thermal path to an absolute minimum, enabling high heat flux densities to be reliably removed in a very small footprint.
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