Referent: David Olalla, Vice President Development & Digitalization, TDK Electronics
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Building on prior studies introducing the modular xEVCap DC‑link solution and its system‑level electro‑thermal evaluation, this paper presents a validated thermo‑mechanical model of a traction‑inverter DC‑link using four xEVCap in parallel. The model, calibrated against a hardware demonstrator, predicts internal hot‑spot temperatures and informs lifetime estimation. We assess a busbar design and fixation strategy (adhesives/gap fillers) that withstand automotive vibration while preserving low ESL and solderability. The modelling workflow powers the CLARA web tool’s Capacitor Banks module, enabling rapid design‑space exploration for 400/800‑V inverters without prototyping.
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David Olalla
Vice President Development & Digitalization, TDK Electronics
David Olalla Telecommunication Engineer in the University of Malaga, Spain (1997), and MBA in ESESA, Spain (2008). Since 2018, Vice President Product Development of Film Capacitors Industry & Automotive at TDK Electronics AG in Munich. Previously, Product Marketing and Field Application Manager at EPCOS in Malaga Spain (2008-2013), TDK Corporation (2013-2018) in Tokyo, Japan. R&D Product Manager of Film Capacitors at EPCOS in Malaga Spain (1999-2008). Parts Engineer at Tecnologica in Sevilla, Spain, for the Rosetta program of the European Space Agency.