FOX-XP Volume Production Test and Burn-In Solution
The FOX-XP system, available with multiple WaferPak Contactors (full wafer test) or multiple DiePakTM Carriers (singulated die/module test) configurations, is capable of functional test and burnin/cycling of integrated devices such as silicon carbide power devices, silicon photonics as well as other optical devices, 2D and 3D sensors, flash memories, Gallium Nitride (GaN), magnetic sensors, microcontrollers, and other leading-edge ICs in either wafer form factor, before they are assembled into single or multi-die stacked packages, or in singulated die or module form factor.

• Wafer stress test 1000s of die in parallel using Wafer Level Test Burn-InlTest
• EVERY die all in PARALLEL on the wafer in ”Single” insertion
• Testing 18 wafers / 10,000s of die in parallel per FOX-XP platform
• 94% reduction in footprint compared to traditional tester/prober