Referent: Ryan Mayberry, Senior Application Development Engineer, Indium Corporation
In this presentation, reliability-enhancing Al-Graphite and Solder preform technologies, including Indalloy® 276 InFORMS® are examined for a power module substrate-baseplate application. Assembly process considerations, as well as Thermal Shock (TST) reliability performance data are benchmarked against relevant industry-standard material sets. The performance advantages realized with Al-Graphite and high-reliability soldering materials present an opportunity to leverage these advanced materials in new power module packaging designs as power densities continue to climb.
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