Highly thermally conductive CeramCool® ceramic heat sinks made of aluminum oxide and aluminum nitride offer numerous possibilities in the thermal management of high-performance electronics, e-mobility, photovoltaics, LEDs and other applications.

CeramCool® heat sinks are an efficient combination of circuit board and heat sink for the reliable cooling of thermally sensitive components and circuits.

Chip-on-heatsink technology eliminates the additional layers and thus thermal barriers required in conventional structures. In addition to thermal resistance, this also reduces the number of components and possible sources of error in the overall system. This has a positive effect on the assembly effort and therefore ultimately on the system costs. The following therefore applies to innovative thermal management with ceramic heat sinks: "Keep it simple" - a simplified system design optimizes heat dissipation.

Our heat sinks have a lot in common for a wide range of thermal management tasks: they impress with high electrical insulation, chemical resistance and corrosion resistance. The design and cooling capacity of the required heat sink are determined by the location and requirements profile.

Our CeramCool® heat sinks are therefore as individual as our customers. At CeramTec, we understand that every project has unique requirements. That is why we offer customized solutions that are perfectly tailored to your needs, taking technical and economic aspects into account.