Preforms with integrated spacers for the most effective bondline-control and beyond.

In preforms fully integrated wires of high melting alloy set into the solder preforms control bondline during soldering as they do not change their state of matter.

Solder:

• due to fully embedded wires, wetting characteristic corresponds with common preforms
• no increased voiding characteristic compared to monolithic solder preforms, due to easy to degase layout
• wide range of common solder materials such as Sn or Pb based solders possible

Wires:

• fully integrated in the solder matrix
• made of metals with a higher melting point than solder matrix material
• providing bondline control
• reinforcing the solder matrix

Benefits:

• Most even bondline in soldering
• Wetting and voiding characteristics corresponding with monolithic solder preforms
• complex geometrical designs for solder joints are stabilized by non-uniform wire inlays
• local diffuison soldered wire-component-segment provide stability in step soldering and reinforcing the joint
• enhanced thermal conductivity