Under the brand name PFDS400® (Preform-based diffusion soldering technology for high temperature applications: above 400 °C), PFARR Stanztechnik offers a revolutionary multi-layer solder range. Using conventional soldering processes with short dwell maximum peak temperatures of 250 °C, these new composite materials produce complete intermetallic phases (IMPs) in the Lead-free solder junctions without pressure or reheating. The resulting structure exhibits a re-melt temperature of over 400 °C.

The composite materials are made from multi-layer systems of tin-based, lead-free solders, together with high melting point metals such as Copper (Cu). The overall thickness ranges from 50 μm to 300 μm. Other alloys and dimensions are available on request.

Our soft solders are characterised by their excellent solderability. Our general range covers the following solder compositions ( melting points from 115°C – 450 °C).

Specifications:

Lead-free solders:

Sn-Basis

Bi-based

In-based

Lead-bearing solders:

Pb-based

SnPb

We are pleased to offer individual alloy compositions and alternative alloy systems to meet your specific needs.

Our braze materials are alloyed under vacuum, free from oxides, resulting in excellent wettability. The following represent our standard alloy range (from 450 °C melting point).

Specifications:

Alloy composition:

Ag-based

Cu-based

Al-based

Au-based

We are pleased to offer alternative alloy compositions to meet your specific needs.

Thin, precious metal coatings in ultra-high purity can be applied to numerous substrates using vapour deposition. The process requires high-purity targets available from Pfarr Stanztechnik. Vapour deposition is used in many electronic products, in optics and medical technology as well as in measurement and control technology; whether onto glass, mirrors or solar cells.

Our exacting process monitoring guarantees an homogenous material quality and unvarying metal structure. We also offer non bonded sputter targets to customer specification.

Specifikations:

Target options:

Precious metal target materials: Ag, Au, Pd, …

Base metal target materials: Al, …

Target purity: 3N5 – 5N

Target design: to customer specification

Preforms with integrated spacers for the most effective bondline-control and beyond.

In preforms fully integrated wires of high melting alloy set into the solder preforms control bondline during soldering as they do not change their state of matter.

Solder:

• due to fully embedded wires, wetting characteristic corresponds with common preforms
• no increased voiding characteristic compared to monolithic solder preforms, due to easy to degase layout
• wide range of common solder materials such as Sn or Pb based solders possible

Wires:

• fully integrated in the solder matrix
• made of metals with a higher melting point than solder matrix material
• providing bondline control
• reinforcing the solder matrix

Benefits:

• Most even bondline in soldering
• Wetting and voiding characteristics corresponding with monolithic solder preforms
• complex geometrical designs for solder joints are stabilized by non-uniform wire inlays
• local diffuison soldered wire-component-segment provide stability in step soldering and reinforcing the joint
• enhanced thermal conductivity