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Designed for the Future - 50 Years of SEMIPACK
Description
Power semiconductor packaging is one of Semikron Danfoss’ core competencies. Since the invention of the world’s first electrically isolated power semiconductor module - SEMIPACK - in 1975, our portfolio of technologies has grown considerably. Our innovations in die attach, layout, housing design, and cooling further advance reliability and effciency in power electronic systems.
SEMIPACK 1 – 6th Generation
- ITAV/IFAV up to 145A and ITSM/IFSM up to 2210A
- Optimized baseplate for improved heat sink contact
- Up to 50% lower Rth
SEMIPACK 2 Performance
- Latest generation of diode and thyristor chips
- Operation temperatures of up to 150°C
- Unrivaled power density in 34mm module
You can find us here:
Address
Semikron Danfoss Elektronik GmbH & Co. KG
Sigmundstr. 200
90431 Nürnberg
Deutschland
Telephone+49 911 65590
Fax+49 911 6559262
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