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Semikron Danfoss Elektronik GmbH & Co. KG Contact
Pioneering the future of E-Mobility
Description
The DCM and eMPack power modules provide scalable, high-performance solutions with exceptional
power density and reliability for a wide range of automotive and commercial vehicle applications.
Flexible Design through Customization: DCM
- Si IGBT and full SiC MOSFET technology
- 750V / 1200V half-bridge design for up to 900 ARMS
- Bond Buffer Sintering Technology for high reliability
- Low thermal resistance thanks to ShowerPower3D
- Robust molded module packaging, low warpage and reliable mechanical integration
- Highest power density
- Multisourcing thanks to chip independency
High Performance Package for e-mobility: eMPack
- Optimized for SiC MOSFET technology
- 750V / 1200V Sixpack compatible package for up to 900ARMS
- Double Sided Sintering package for automotive grade reliability
- Low thermal resistance thanks to Direct Pressed Die Technology
- Flexible cooler arrangements
- 2.5nH package stray inductance including terminals
- Multisourcing thanks to chip independency
You can find us here:
Address
Semikron Danfoss Elektronik GmbH & Co. KG
Sigmundstr. 200
90431 Nürnberg
Germany
Telephone+49 911 65590
Fax+49 911 6559262
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