The European Test and Reliability Center (ETRC) at Fraunhofer ENAS is a unique center of excellence in Europe for testing and reliability assessments of future semiconductor innovations.

Combing cutting-edge infrastructure, in-depth expertise and a strong network of academia and industry, the ETRC provides reliable solutions ensuring the quality, performance and durability of pioneering microtechnologies.

The ETRC covers both research and development of new testing and evaluation methods as well as their optimization for specific applications. In addition, the ETRC offers a broad range of services for the verification of small series and practical consulting for companies. A specialized training and education program enables the targeted qualification of professionals in the field of testing methods and reliability assessments.

Find out more about our offer at our booth:

Tests at wafer, chip, and component level

• Electrical tests (functional, burn-in, and performance tests) with automatic wafer probers
• Optical tests using an optical probe station for photonic integrated circuits
• Magnetic tests for MRAM and magnetic sensors
• MEMS tests (C, V, I, f0, Q, specific parameters) and motion analysis for MEMS (also under vacuum)
• High frequency tests up to 110 GHz
• Acoustic tests for micromechanical ultrasonic transducers (MUTs) and acoustic components
• Near-field measurements for EMC and error tracing
• High-power tests

Characterization

Inline measurement techniques:

• Scanning electron microscopy (EDX/SEM, FIB/SEM, EBSD/SEM, CD-SEM, microsection preparation)
• Atomic force microscopy (tapping, deep trench, CD, profiling, KPFM, SNOM, fluidic actuation [Fluid-FM])
• Inspection (pattern and wafer defect detection, particle inspection)
• Microscopy methods (optical wide field, laser scanning, confocal, IR, ultrasound)
• Wafer geometry (BOW, TTV, WARP)
• Profilometry (optical and tactile, planar 3D microscopy, nanoscale scans)
• Layer characterization (sheet resistance, ellipsometry, reflectometry)
• Characterization of bond strength (micro-chevron and compression shear test)
• Characterization of hermeticity (helium leak test)

Offline measurement techniques:

• Spectroscopy (time-resolved FTIR measurements, fluorescence spectroscopy [spatially and time-resolved], confocal microscopy, ultraviolet spectroscopy, Raman spectroscopy, TGA/DSC+FTIR, μWave spectroscopy up to 50 GHz)
• Optical characterization of light sources (radiometric and photometric measurements, DC, AC, and transient characterizations)
• Characterization of inertial sensors (tumble test and rotation rate via temperature, vibration, high-g)
• Characterization of liquids (density, viscosity, particle sedimentation, pH value determination, contact angle measurements, cyclovoltametry, impedance measurements, rheometry)
• HF characterization (antenna test chamber, vector network analysers, power amplifiers)
• Laser Doppler vibrometry (3D, infrared)

Reliability assessment

• Accelerated lifetime tests with mixed loads
• Environmental tests (humidity, degradation)
• Long-term climate and load tests under realistic conditions
• Deformation analysis
• Thermoelectromechanical resistance (HT, (H)TC, APC)
• Mechanical stress (tension, compression, shear, bending, scratching, vibration, shock)
• Nano-fatigue and membrane tests

Data analysis

• AI-based segmentation, object detection, and classification in measurement images
• Evaluation (e.g. anomaly detection and feature extraction) of time series data
• Prediction of test and measurement results using complex data-based models
• Integration of expert and physical knowledge for more robust and reliable models with low data availability