BERGQUIST® GAP FILLER TGF 4400LVO is a silicone, 2-part, room temperature curable gap filler, ideal for a wide range of electronic assembly applications. With 4.4 W/(m.K) thermal conductivity and the possibility to achieve thin bondlines, it provides an excellent and versatile solution for optimizing heat dissipation in demanding applications. Its superior mechanical stability offers reliability and consistency in harsh operating conditions over the entire lifetime of electronics components. Perfect for use in automotive, industrial and consumer applications.