BERGQUIST® HI FLOW THF 5000UT is a phase change thermal interface material designed for use between a heat sink and a variety of heat generating components. The material flows at its phase change temperature and conforms to the surface features of the components. During flow, air is expelled from the interface and thermal impedance is reduced, enabling highly efficient thermal transfer.

LOCTITE® STYCAST CC 8555 is a conformal coating designed to provide rugged protection from moisture and harsh chemicals. It is compatible with industry standard solder masks, no-clean fluxes, metallization, components and substrate materials. Specifically formulated to rapidly gel and immobilize when exposed to UV light and then fully cure when exposed to atmospheric moisture, ensuring optimum performance even in shadowed areas. LOCTITE® STYCAST CC 8555 has a V0 rating per UL 94 and has a Relative Temperature Index (RTI) rating of 130°C (266°F) per UL 746E.

BERGQUIST® GAP FILLER TGF 2900LVO is a silicone, 2-part room temperature curable gap filler suitable for use in a wide range of electronic assembly applications. With a thermal conductivity of 2.9 W/(m.K) and a possibility to achieve ultra-thin bondline thickness, it provides an excellent and versatile solution to optimize heat dissipation in challenging conditions. This material is an exceptional choice for the use in automotive, industrial and consumer electronic applications.

BERGQUIST® GAP FILLER TGF 4400LVO is a silicone, 2-part, room temperature curable gap filler, ideal for a wide range of electronic assembly applications. With 4.4 W/(m.K) thermal conductivity and the possibility to achieve thin bondlines, it provides an excellent and versatile solution for optimizing heat dissipation in demanding applications. Its superior mechanical stability offers reliability and consistency in harsh operating conditions over the entire lifetime of electronics components. Perfect for use in automotive, industrial and consumer applications.