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Heraeus Electronics GmbH & Co. KG

Condura®.ultra Ag-free AMB Substrate

Description

Condura®.ultra is a cost efficient, highly reliable Ag-free AMB substrate that enables bonding silicon-nitride-based ceramics with copper foils. Condura®.ultra was developed using a special technique enabling high performance Si3N4 substrates by using new, Ag-free active metal brazing (AMB) bonding technology.

Condura®.ultra is designed to offer outstanding reliability and processing (e.g., sintering, bonding, soldering). The high-performance Si3N4 Ag-free AMB substrate is available with standard and thick Cu layers and thermal conductivity of ≥60 W/m.K and ≥80 W/m.K.

You can find us here:

  • PCIM

Address

Heraeus Electronics GmbH & Co. KG
Heraeusstr. 12-14
63450 Hanau
Germany

Telephone+49 6181 350

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