Condura®.ultra is a cost efficient, highly reliable Ag-free AMB substrate that enables bonding silicon-nitride-based ceramics with copper foils. Condura®.ultra was developed using a special technique enabling high performance Si3N4 substrates by using new, Ag-free active metal brazing (AMB) bonding technology.

Condura®.ultra is designed to offer outstanding reliability and processing (e.g., sintering, bonding, soldering). The high-performance Si3N4 Ag-free AMB substrate is available with standard and thick Cu layers and thermal conductivity of ≥60 W/m.K and ≥80 W/m.K.

Heraeus Electronics' Die Top System (DTS®) facilitates copper bonding on sintered power semiconductors, offering high flexibility and an alternative to standard clips. It enhances both electrical and thermal conductivity, as well as the reliability of die connections. DTS® boosts overall module performance, streamlines industrialization, and ensures competitive costs of ownership.

The Die Top System now comes in two variants to cater to diverse market requirements:

DTS® Gold - The trusted solution for exceptional performance in premium applications.

DTS® Silver - The innovative solution for cost-efficient, high-performance applications.

Sintering is an established technology for the die attach in power modules and has widely replaced soldering due to its superior properties. To fully use the potential of a power module, the next step is to enable pressure sintering for the interface between the module and the baseplate or heatsink.

mAgic® PE360 is designed to enter a new era in pressure sintering. Due to the large area, the drying performance with regards to drying time and voiding channels is key. At the same time the heat needs to be dissipated away from the power module. This increases efficiency, reliability and allows the module to be operated with higher power or less semiconductor material. Additionally, the sintering parameters must be decreased to a minimum. Transfer molded power modules are sensitive components which, being exposed to high mechanical pressure and temperature, can easily suffer damage during the sintering process. mAgic® PE360 is specifically engineered for the challenging requirements of module attach sintering.