Shin-Etsu’s liquid dispensed gap fillers are silicone materials enriched with fillers to provide high thermal conductivity while ensuring electrical isolation. They are used as thermal interface materials to fill gaps between components and heat sinks. While they are dispensible similar like thermal greases they are not prone to pump-out.

Because they are applied in liquid form, they cause less stress on components during assembly. The material cures in place and remains a soft elastomer.

They can accommodate a wider range of gap thicknesses, as the liquid can be applied in different thicknesses across adjacent areas to accommodate complex interface topography and can compensate surface unevenness.

The gap fillers provide a natural tack between mating surfaces without creating a structurally adhesive connection. They are available as one- or two-part materials.