Shin-Etsu’s liquid dispensed gap fillers are silicone materials enriched with fillers to provide high thermal conductivity while ensuring electrical isolation. They are used as thermal interface materials to fill gaps between components and heat sinks. While they are dispensible similar like thermal greases they are not prone to pump-out.

Because they are applied in liquid form, they cause less stress on components during assembly. The material cures in place and remains a soft elastomer.

They can accommodate a wider range of gap thicknesses, as the liquid can be applied in different thicknesses across adjacent areas to accommodate complex interface topography and can compensate surface unevenness.

The gap fillers provide a natural tack between mating surfaces without creating a structurally adhesive connection. They are available as one- or two-part materials.

Our high temperature Gels are ideal for applications in high-temperature environments, such as automotive, and high-power electronics, where thermal stability and flexibility are crucial.They ensure high electrical insulation acorss a wide temperature range. They are very reliable over a long period of time at extreme temperatures.

The gels are also used as protective potting of electronic components, protecting them against various external elements like moisture, condensation and dust. They also help to reduce mechanical stress on electronic components caused by extreme temperatures and vibration.

The TC series is a product line made of pre-cured thermal interface silicone rubbers which offer superior electrical insulation. Special fillers have been added to boost heat-dissipating performance.

Thermal Interface sheets are categorized into three types; high-hardness rubber thermal interface sheets, low-hardness rubber thermal interface sheets, and phase-change materials that soften when heated.

Various types of TC Pads are available:

• High-hardness Thermal Interface Silicone Rubber
• Thermal Interface Silicone Soft Pads
• Thermal Interface Silicone Ultra Soft Pads
• Double Sided Thermal Interface Silicone Tapes
• Thermal Interface Phase Change Materials

These products have superior thermal conductivity, elasticity, and adhesiveness (Low-hardness type), so they offer highly effective heat dissipation. Ultra Soft Pads offer low contact resistance while keeping high thermal conductivity due to their high flexibility.