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Copper block/spacer for 3D stack power module
Description
Our Block Bonding solution is engineered to deliver superior thermal and electrical conductivity for demanding high-power packaging applications. This advanced joining technology securely bonds high-thermal-conductivity copper to substrates with minimal voiding. Optimized for Automotive/Power, RF, and IDM/OSAT applications, our block bonding technology ensures maximum heat transfer efficiency, robust mechanical strength, and structural integrity even under extreme thermal cycling environments.
• QFN power modules leverage block bonding technology to integrate multiple dies, significantly imprverticallyoving electrical efficiency and thermal performance.
• Adoption is accelerating across AI servers, PSUs, and hyperscale data centers demanding higher power density and enhanced thermal reliability.
