ACT’s Pumped Two Phase (P2P) Cooling Products and Solutions are based on patented technologies, and use a noncorrosive and non-electrically-conductive fluid which vaporizes and cools hot surfaces on contact. These products are ideal for cooling of high-power electronics where heat loads have increased to a level beyond what traditional air and water cooling systems can effectively manage.

By combining a non-conductive dielectric refrigerant with the science of heat dissipation through vaporization, our Pumped Two Phase Cooling Products can increase power densities for high-power electronics by more than 2x over traditional water / glycol systems, while eliminating the dangerous consequences of a fluid leak. Although the systems are leak tight, should an accidental leak occur, the non-conductive fluid is inherently safe even when in direct contact with sensitive electronics.

Combining the high heat removal of the two-phase heat transfer technology with the high reliability of low-flow liquid pumping, ACT’s P2P system is highly modular (hot swappable) and scalable. With such high-efficiency, it simplifies the plumbing and reduces the overall size and weight, providing an excellent thermal performance/cost ratio. And, due to the inherent non-corrosive properties of the fluid, no regular end user maintenance is required.

ACT’s Pumped Two Phase Products benefit a broad spectrum of industries including:

• Hybrid and Industrial Vehicles
• Industrial Power Electronics
• Power Transmission and Distribution
• Alternative Power Generation
• Marine and Rail Propulsion
• Medical Equipment
• Telecommunications
• Military

Consider Pumped Two Phase Cooling for applications that:

• Have critical packaging constraints
• Have a propensity for high cyclical loads
• Call for more power output from a given device package (e.g., increased switching frequency or difficulty in paralleling devices
• Need modular and easy field service (quick dry break connectors)
• Involve high-voltage and use de-ionized water
• Require elimination of the chiller

HiK™ or high conductivity plates are heat spreaders with embedded heat pipes to transport heat as desired in your system. These plates are particularly useful for cooling of multiple high power components. The HiK™ plate collects and moves the heat from these discrete heat sources to the liquid cooled edge or air cooled heat sinks with minimal temperature gradients. As electronics continue to move forward with higher power and smaller packaging, HiK™ plates are a great way to move heat to boost performance. Whether it’s adding more power to the system or reducing the hot spot temperature in hot ambient environments, HiK™ plates provide a reliable, easily integratable thermal solution.

Heat pipes operate in liquid and vapor phase, taking advantage of the latent heat of vaporization to move heat extremely efficiently across their length. Heat pipe assemblies can provide point to point heat transfer to allow for remote heat sinks and embedded heat pipe designs can efficiently spread heat across long surfaces. Although they are two-phase devices; their effective thermal conductivities are an order of magnitude higher than standard metals used for heat sinks. Heat pipes are proven and fielded in numerous high-power applications and provide long-life operation and system design flexibility.

Thermosyphons offer passive, reliable transport similar to heat pipes, except they leverage gravity to return the fluid. By designing thermosyphons in a loop configuration, it eliminates counter fluid flow and increases the power transport capability dramatically. Loop Thermosyphons are frequently used to transport large heat loads to remote heat sinks above the power electronics devices. They can also incorporate flexible lines to make for easy integration into your system.

Loop thermosyphons are often used in high-power and high-heat-flux applications.

The thermal resistance of loop thermosyphon cold plates can be less than 0.005 °C/W. A second benefit is that the condenser can be located remotely from the cold plate, and attached using quick disconnects.