CeramTec is your One-Stop-Shop for all common ceramic substrates and offers everything from a single source: aluminium oxide, aluminium nitride (with a bending strength of 450 Mpa), zirconium toughened aluminium oxide ZTA and silicon nitride. A special highlight will be the official launch of our new aluminium oxide 98% substrate, which we will bring to market in 2025. This substrate offers optimised properties for demanding power electronics applications and complements our already proven portfolio.

In addition to the ceramic substrates, this also includes engineering as well as laser processing and metallisation of the substrates. The comprehensive one-stop-shop portfolio of ceramic materials enables our customers to source all major ceramic substrates from a single European manufacturer, supplement them as needed and streamline their supply chains.

Aluminium Oxide Substrates

• Best cost/performance ratio
• Lower thermal conductivity compared to nitride ceramics
• Fields of application: Industrial, Renewable and Vehicle Electrification

Aluminium Nitride Substrates

• High thermal conductivity
• CTE (Coefficient for Thermal Expansion) very close to silicon
• Fields of application: Train, Industrial, Renewable and LED

Zirconia Toughened Alumina Substrates

• Improved flexural strength
• Increased fracture toughness
• Fields of application: Industrial, Renewable and Vehicle Electrification

Silicon Nitride Substrates

• High flexural strength
• High fracture toughness
• Good thermal conductivity
• Fields of application: Electro Vehicle, Vehicle Electrification, Industrial and Renweable

Performance & Advantages

• Optimized Thermal Management
• High Packing Density
• Electromagnetic Behaviour
• High Thermal Conductivity
• High Durability
• High Chemical Resistance
• High Mechanical Resistance
• Electrical Insulating Capacity
• High Dielectric Constant
• High-Frequency Capability

Lasered and Metallised Substrates

At CeramTec, we manufacture and process ceramic substrates using various processes depending on the application, material, geometry and number of pieces: From punching, lasering and dry pressing to various hard machining processes.

In addition, we also metallise the substrates ourselves, making them ideal for direct assembly with electronic components. The metallisation pastes are developed by ourselves and are characterised by high adhesive strength, good solder flow and excellent resistance in solder baths. In the process, a conductive layer is applied to the substrate to create the conductor paths and connections for the electronic components and to protect the substrate from corrosion or other environmental influences.

Do you need sensors and piezos made of ceramic? Do you want to find out more about application areas, measuring and control performance? Or do you need information about possible designs and sizes?

Visit us at the Sensor + Test trade fair which takes place at the same time in Hall 1, Booth 530.

CeramTec's piezoceramic components are used as a wide variety of electromechanical transducers in a broad frequency range.

Here is an overview of the numerous possible applications of technical ceramics in piezo technology

Piezoceramics in automotive engineering

• Knock sensor
• Reversing sensor
• Acceleration sensor
• Rotating rate sensor
• Sonar transducer for object detection
• Sonar transducer for positioning/navigation
• Level sensors
• Air flow sensor
• Power generation for tire pressure sensors

Piezoceramics in equipment and mechanical engineering

• Air-ultrasonic distance sensors
• level sensors
• Flow measurement (liquid and gaseous media)
• Ultrasonic cleaning
• Ultrasonic welding (plastic and metal)
• Ultrasonic material processing
• Non-destructive material testing
• Active vibration damping of tools

Piezoceramics in medical technology

• Kidney stone disintegrator
• Dental scaler
• Surgical knives
• Ultrasonic nebulizers for inhalers
• Ultrasound diagnostics and therapy

Piezoceramics in actuators

• Active vibration damping
• Hydraulic and pneumatic valves
• Optical fiber adjustment
• Precision adjustment devices
• Sound generation

Piezoceramics in consumer products

• Pickups for instruments (guitar pickups)
• Burglar alarm systems
• Atomizers for medical and cosmetic applications

CeramTec - according to our motto "the ceramic experts" we support you as experts with words and deeds, so that you as our customer get the optimal sensor for your application.

Highly thermally conductive CeramCool® ceramic heat sinks made of aluminum oxide and aluminum nitride offer numerous possibilities in the thermal management of high-performance electronics, e-mobility, photovoltaics, LEDs and other applications.

CeramCool® heat sinks are an efficient combination of circuit board and heat sink for the reliable cooling of thermally sensitive components and circuits.

Chip-on-heatsink technology eliminates the additional layers and thus thermal barriers required in conventional structures. In addition to thermal resistance, this also reduces the number of components and possible sources of error in the overall system. This has a positive effect on the assembly effort and therefore ultimately on the system costs. The following therefore applies to innovative thermal management with ceramic heat sinks: "Keep it simple" - a simplified system design optimizes heat dissipation.

Our heat sinks have a lot in common for a wide range of thermal management tasks: they impress with high electrical insulation, chemical resistance and corrosion resistance. The design and cooling capacity of the required heat sink are determined by the location and requirements profile.

Our CeramCool® heat sinks are therefore as individual as our customers. At CeramTec, we understand that every project has unique requirements. That is why we offer customized solutions that are perfectly tailored to your needs, taking technical and economic aspects into account.

With silicon nitride, we offer a reliable solution for a wide range of applications in high-performance electronics, such as electric vehicles, vehicle electrification, industry and renewable energy.

Key advantages:

• High flexural strength ≥ 700 MPa
• High fracture toughness ≥ 6.5 MPa*√m
• Dielectric strength AC/DC: ≥ 25 kV/mm

These properties ensure extreme robustness for applications with the highest power density in power electronics, especially with thin Sinalit substrates (≥ 0.25 mm).

In addition, the material has a high thermal conductivity of 90 W/mK. In combination with AMB (Active Metal Brazing) or SMB (Sputter Metal Bonding) metallization options, Sinalit is the optimal choice for WBG (Wide Band Gap) dice, such as those used in semiconductor-based power modules.

Together with active components, passive components form the foundation in the fast-paced world of electronics. They fulfil elementary tasks, such as the power supply of a device or the transmission of signals, and ultimately form electrical and electronic circuits.

Technical ceramics are once again convincing as a material for passive components due to their outstanding properties. Particularly noteworthy in this context is the possibility to realise almost one hundred percent pore-free surfaces. Furthermore, technical ceramics are characterised by excellent electronic insulating properties, high strength and thermal conductivity.

Our ceramic cores for passive components are characterized by highest resilience and flexural strength.

The ceramic cores are used, for example, as

Coil bodies

• Partially metallized coilformers
• Fully copper-plated ceramic support bodies for laser-wound inductors
  

Resistors in the designs as

• metal oxide-,
• carbon film,
• metal film,
• thin film and
• wire-wound resistors

- Fuse bodies

What can our ceramic and implementation experts do for you? Contact us directly at myceramTec@ceramtec.de. Tell us what we can do for you. We will find an optimal economic and technical solution for your application of cores made of technical advanced ceramics.