With silicon nitride, we offer a reliable solution for a wide range of applications in high-performance electronics, such as electric vehicles, vehicle electrification, industry and renewable energy.

Key advantages:

• High flexural strength ≥ 700 MPa
• High fracture toughness ≥ 6.5 MPa*√m
• Dielectric strength AC/DC: ≥ 25 kV/mm

These properties ensure extreme robustness for applications with the highest power density in power electronics, especially with thin Sinalit substrates (≥ 0.25 mm).

In addition, the material has a high thermal conductivity of 90 W/mK. In combination with AMB (Active Metal Brazing) or SMB (Sputter Metal Bonding) metallization options, Sinalit is the optimal choice for WBG (Wide Band Gap) dice, such as those used in semiconductor-based power modules.