THERMASOLV CF1 is a dielectric heat transfer fluid, dedicated for 1-phase immersion or direct cooling systems. It’s high electrical insulation properties allows to immerse electronics & electrical devices under power in the fluid. The favorable characteristics of the product’s viscosity, density and surface tension allows optimal surface contact, which contributes to a superior heat transfer performance.
It’s very good compatibility with all metals, a wide range of plastics & elastomers and the chemical stability of the fluid, makes THERMASOLV CF1 an ideal fluid for immersion cooling.
THERMASOLV CF1 is formulated with safety in mind. It is non-toxic, has no mentioning of any EUH-phrases, is non-flammable and has no flash point.

Sintering solutions are used as an alternative to solder paste in applications where high thermal and electrical conductivity, reliability, and mechanical strength are critical.
Some key areas where sintering is preferred include lead free die-attach, large area module attach, E-Vehicle, Energy conversion of Renewable energies, Optoelectronics and RF power devices.
Especially with the latest SiC and GaN developments operating at much higher power, using sintering interconnections with higher thermal and excellent electrical conductivity is crucial. The All-in-One sintering process has the potential to reduce the total cost of ownership for such applications dramatically. Ideally, an usually two-step process, die sintering and substrate sintering, can become a one step process: saving energy, consumables, and time by 50%.
ECORELTM SINTEC AP90 shows a great flexibility from small to large surface areas but also for material stacks which are prone to warpage during sintering and stress test.

High thermal conductivity :
ECOREL™ SINTEC sintering solutions achieve thermal conductivity values exceeding 300 W/mK, providing exceptional heat dissipation and making them an ideal choice for high-power applications.

High shear strength :
With a shear strength exceeding 50 MPa, robust interconnects are formed, enabling assemblies to
easily withstand Thermal Cycling Testing (TCT) from -55°C to +125°C for over 1000 cycles.

Room temperature storage :
Most sintering pastes require refrigerated or frozen storage, but our sintering solutions can be stored at room temperature, making them much easier to handle, while still providing a 6 months shelf life.

No nanoparticles :
Unlike other sintering solutions available on the market, ECOREL™ SINTEC products are free of nanoparticles, making them safer for both users and the environment

ADDITIONAL ADVANTAGES :
• Processing with established equipment
• Highly reproducible and reliable
• Low electrical resistivity (3 μΩ.cm)
• No CMR containing substances, no halogen and no nanoparticles
• RoHS compliant
• Ten-fold improvement of Power-module lifetime
• Worldwide product availibilty & technical support

ECOREL 305-16LVD is especially designed to reduce the dimension and amount of voids. This is especially beneficial when soldering bottom terminated components and for applications where excellent thermal management is crucial. A reduction of voids contributes to a better heat dissipation, more reliable electrical connection and a better intermetallic solder joint strength.
This solder paste is furthermore well balanced in terms of wettability, reliability, good compatibility with most conformal coating in the market and transparent clear residues. Besides the type 4 solder paste formulations are made from 100% recycled metals and paste in jar packaging can be stored at room temperature, which contributes to an overall reduction in CO2 emissions.

PROMOSOLV COAT UT10-UV is a transparent hydrophobic and oleophobic ultrathin coating to protect electronics and other surfaces against moisture, corrosion and other environmental conditions that could jeopardize the reliability of the device or surface. Adheres well to a wide variety of material substrates as plastic, glass, metal and ceramic. This product is formulated with a UV tracer for easy detection under UV light in order to support quality control.
The coating is available with a 2 and 4% solid content, which provides a different dry film thickness.

TOPKLEAN EL 80 is especially designed to clean solder flux residues after reflow. It is our latest development based on our new QSA technology, which allows faster solubilization of organic compounds. A substantial increase of flashpoint, enhanced cleaning performance and reduction of surface tension makes this product the number one choice in its application. A guarantee to have perfect cleaning under very low stand-off components! Its excellent ability to solubilize organic and minerals compounds allows to remove almost any solder flux residues used in the electronic industry today. It leaves no white residues and also provides a shiny effect on alloys & metals.
It is used in co-solvent process to offer a fast & sustainable cleaning process with very high cleaning efficiency. In this process, TOPKLEAN EL 80 is rinsed perfectly with solvents from our PROMOSOLVTM range. Thanks to the even lower surface tension, the rinsing fluids penetrate into the very tight spaces and under low stand-off components. It will remove any remaining flux residues and cleaning fluids, resulting in very low ionic contamination levels.
The co-solvent process has been a game changer for over 15 years now and is qualified and used by several actors in the electronic industry. Compared with a water-based cleaning system, there is no risk of corrosion due to the absence of residual water left on the boards.