Vincotech’s latest generation of base-plated housings enables PV & ESS system designers to push the leading edge of the renewable energy even further. The new flow E3BP supports development of 350 kW systems and beyond thanks to the optimally shaped baseplate which ensures superior thermal contact.

This leads to excellent thermal performance and maximized power density enabling designers to tame the future of tomorrow’s renewable energy demands. The housing material is specifically chosen to meet the voltage requirements of the next generation 2000 V systems.

Features

• Convex baseplate with special surface treatment for superior thermal contact
• CTI600 housing material for higher systems voltages
• Isolation walls for increased creepage and clearance distance
• Optional pre-applied thermal interface material
• Solder or Press-fit pins
• 12 mm mounting height

Partner up for solar solutions with Vincotech!

Making the right design choices is critical to a product’s success in the market. Designers of solar inverters face a multidimensional challenge to ensure solar power continues to meet the growing demand for clean energy. Vincotech offers unique opportunities for system optimization in terms of efficiency, weight, cost and reliability.

• Fully optimized and tailor-made solutions for 1500 V systems with a broad range of power modules for consumer, commercial and utility market.
• Latest topologies, including NPC, ANPC, MNPC, Flying Capacitor, H6.5, etc, provide significant efficiency improvements, module and system level cost savings, and system weight reduction
• Easy-to-design <10kW consumer systems
• High density three-phase integrated solutions for small commercial systems
• Component supplier independent for secure supply chain
• Advanced die-attach for increased reliability
• One of the broadest range of housings available
• 25+ years’ experience in Power Modules

More information, videos, white papers etc available at vincotech.com/cleanerfuture

VINcoSIM is a web-based integrated simulation environment to simulate junction temperatures and loss for Vincotech power modules. The software is designed to choose operation conditions as voltages, currents and switching frequencies to give a good fitting to the operation of the power module in real applications. All power loss and temperature calculations are based on real measurements taken of each module.

Why use VINcoSIM?

• It is accurate:
  We use real measurement data, all topologies are available, heatsink option is included.

• It is fast and complete
  The procedure takes only seconds and the results reveal a lot of data in one glance.

• It is easy to use
  Only 1 configuration step is needed, flexible options for your needs, no downloading necessary, no cost.

VINcoSIM is based on an unique simulation core which offers the possible to simulate every module with every topology. Adding new modules and even increase the number of simulation methods was never easier.

Experience VINcoSIM at vincotech.com/vincosim

Unlock the Full Potential of SiC Technology

Maximize efficiency and reliability with our cutting-edge SiC components, designed to give you greater flexibility and a more resilient supply chain. Our portfolio covers a wide voltage range from 650V to 2.xkV, ensuring the right fit for your power electronics needs.

• Multi-sourced SiC components for more freedom of choice and lower supply chain risks
• Higher switching frequencies enabled by low-inductive housings
• Enhanced power cycling capability with advanced die attach technology
• Superior thermal performance with AlN or Si₃N₄, ensuring homogeneous Rth distribution

Stay ahead with SiC solutions engineered for performance, efficiency, and long-term reliability.

flowDUAL Ex SiC:

• New 2.x kV Half-Bridge power modules - Higher power density without compromising efficiency
• Optimized for 1500 Vdc applications addressing maximum power density and greater scalability
• Reduced system complexity by enabling 2-level operation with 1500V DC link voltage

fastPACK 1 GaN:

• Industry standard package for GaN technology - take WBG to the next level
• 2-in-1 topology: H-Bridge, or Half-bridge module based on E-mode GaN HEMTs
• Utilizing Vincotech's standard process for soldering and bonding
• Suitable for use of external gate drive
• Capable of reaching high dv/dt slew rates over 150V/ns
• Integrated snubber capacitors
• Low loop inductances

Simple and cost-effective power modules for industry applications

Widest Range of Solutions for Industrial Applications from Vincotech. The very well-known power converter topologies for industrial drives applications are:

• Sixpack
• Rectifier + inverter + brake = the power integrated module (PIM)
• TWIN topology

VINcoPress Technology - Cutting-edge technology furnished inside dedicated power module solutions that brings superior thermal performance.

A tandem diode configuration is a smart way of striking the right balance between cost and performance. This simple assembly connects two 650-V devices with low dynamic loss coefficients aims to provide a cost-effect alternative to WBG devices. Connected tandem diodes are the right solution for sixpack topologies and in inverter stages of PIM systems, outperforming standard topologies and bringing high efficiency with affordable prices.

More information at vincotech.com/industrialdrives