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Fujian Huaqing Electronic Material Technology Co., Ltd.

Direct Bonded Copper(DBC)

Fujian Huaqing Electronic Material Technology Co., Ltd.

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Description

It's a high insulation of Al2O3 or AlN ceramic substrate attached to a new composite material of copper metal. After heating by high temperature 1065~1085℃ environment, copper and metal produce eutectic melt with ceramic because of high temperature oxidation and diffusion, so that copper and ceramic are bonded to form ceramic composite metal substrate. Then through exposure development, etching and other steps to produce line substrate.

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More products by Fujian Huaqing Electronic Material Technology Co., Ltd.

Active Metal Brazing(AMB)

A further development of the DBC process, it is a method of joining ceramics and metals by using a small amount of active elements such as Ti and Zr in the brazing material to react with ceramics to form a reaction layer that can be wetted by the liquid solder. AMB relies on the chemical reaction between the ceramic and the active metal solder at high temperature to achieve bonding, which results in higher bonding strength and better reliability.

AlN Master Card

Adopting advanced molding process: casting molding, the process has the characteristics of high production efficiency, low cost, uniform and consistent embryonic properties, process stability, etc. And special specifications can be customized according to the customer's requirements.

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