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Wire Bonder Bondjet BJ955/BJ959/BJ985
Description
Fully automatic ultrasonic wire bonder for heavy wire applications
The ultrasonic wedge-wedge heavy wire bonder meet the latest requirements in terms of technology and flexibility for automotive and power electronics.
The wire bonder, designed as fully automatic or alternatively for manual operation, offer large working areas, changeable bonding heads for aluminum and copper wire or ribbon, an optional thermosonic function and automation solutions.
Bondjet BJ955/959 and Bondjet BJ985 belong to the new generation of ultrasonic wedge-wedge bonders developed for the fully automated processing of a wide range of large-sized substrates, chips, automotive applications (e.g. batteries) and other puposes.
The systems can be used as a fully automatic machine or operated manually. Hesse offers the only available solution on the market of handling wires from 50 μm up to 600 μm** with only one bondhead.
The Heavy Wire Bonder are characterized by several features:
- Optimized pattern recognition (PR)
- Software features for the growing demand of connectivity andindustry 4.0 (e.g. Hesse Bonder Network, remote control of PR,improved MES integration, …)
- Hesse Assist Tools: load cell, bondtool and wire spool detection, tool calibration without wedge gauge for operator independency
Outstanding features are high speed and the large working areas. A bondhead change from aluminium to copper can be realized within minutes. Hesse GmbH, as technology leader, has designed the only heavy wire bondhead with a non destructive pulltest and a unique transducer integrated sensor for 100 % quality monitoring in real time. In addition to a standard configuration Hesse offers automation concepts individually



