Skip
Tickets for the PCIM Expo & Conference 2026

Ready for the future? Take off into the world of power electronics with your ticket – full of innovations, trends, and new impulses. Secure your ticket now:

Search and find – exhibitor search provides a comprehensive overview of industry players, featuring detailed profiles of the PCIM Expo exhibitors 2026 as well as the latest solutions and products in power electronics.

Zhejiang HenYa Electronic Technology Co., Ltd.
Product: Hardware machining products

Hardware machining products

Zhejiang HenYa Electronic Technology Co., Ltd.

Description

Precision metal machining customized parts
We specialize in manufacturing various high-precision hardware machining components, including turning, milling, grinding, and more CNC, Precision machining processes such as stamping and cold forging. The product is widely used in high-end manufacturing fields such as communication equipment, artificial intelligence terminals, industrial automation, and robot manufacturing.

We strictly control the entire process from raw material selection to finished product testing, ensuring that our products have the characteristics of high precision, high stability, and high consistency. We could meet customers' customized requirements for complex structures, high-precision tolerances, and special surface treatments, and provide reliable core structural support for the intelligent equipment and electronic communication industry.

More products by Zhejiang HenYa Electronic Technology Co., Ltd.

IGBT Components

IGBT Components

IGBT power module dedicated hardware structural components -- High reliability, strong heat dissipation, precision manufacturing

As the core support and heat dissipation carrier of IGBT power modules, the hardware structural components is designed specifically for high power and high reliability power electronics applications. We use high-quality copper, and special alloys, and use precision stamping, CNC machining, and surface treatment processes to ensure excellent mechanical strength, insulation performance, and thermal management of our products, providing a stable and efficient working environment for IGBT chips.

Product Features
Efficient heat dissipation design
Optimize the structure in conjunction with the heat dissipation substrate and thermal interface material to achieve low thermal resistance conduction and significantly improve the module's heat dissipation capability.
Support multiple heat dissipation solutions such as water cooling, needle wings, fins, etc., to meet the requirements of different power levels.

Mechanical and electrical reliability
The material has high rigidity, low thermal expansion coefficient, resistance to vibration and impact.
The surface can be treated with nickel plating,Tin plating, Golden plating etc. to meet the requirements of electrical insulation and corrosion resistance.

Precision manufacturing and flexible customization
Strict tolerance control ensures compatibility with IGBT chips PCB, Accurate fit of the shell.
Support customized requirements for customer sizes, hole positions, interfaces, and special coatings.

Lightweight and integrated design
Achieving compact design while ensuring structural strength helps with module miniaturization and system integration.

Typical Applications
Industrial frequency converter, servo drive UPS
New energy: photovoltaic inverters, wind power converters, energy storage systems
Electric vehicles: electric drive controllers, charging stations
Power electronic equipment such as household appliances and communication power supplies

We are committed to providing safe and durable high-end structural component solutions for power modules, using precision craftsmanship and professional design to help your products operate stably in harsh environments.

1 / 2