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Firstack Technology Co., Ltd.
Trade fair innovation
Product: Gate driver solution for multiple SiC modules in parallel 2FHC06M33

Gate driver solution for multiple SiC modules in parallel 2FHC06M33

Firstack Technology Co., Ltd.

Description

The 2FHC06M33XX is a high-performance, dual-channel SiC/IGBT gate driver core based on Firstack intelligent chip technology, supports SiC/IGBT modules up to 3300V. It is composed of a MCC (main control core) and multiple MAB (module adaptor board) units. The MCC and MAB are connected by a set of cables, which can flexibly match 1 to 4 SiC/IGBT modules and has excellent current sharing effect. In addition, the 2FHC06M33XX features distributed NTC sampling, the temperature information of each paralleled module can be accurately read and transmitted to the customer through isolation, which greatly reduces the customer development cycle. It is suitable for Infineon XHP_2, Mitsubishi LV100, Hitachi Linpak and other packaging multi-parallel, and mainly used in rail, PV, wind, industrial drives and other high-reliability fields.

  • Jitter time < 3ns
  • 3300V X4
  • VGS adjustable
  • Isolated NTC sensing

A Brief Introduction of SiC Gate Driver Solution 2FHC06M33

2FHC06M33XX is a high-performance, dual-channel SiC gate driver core developed based on Firstack
intelligent chip technology, supports SiC modules up to 3300V.

The overall architecture consists of a MCC(main control core) and multiple MAB (module adaptor board) units, the MCC and MAB are connected by a set of cables, which can flexibly match 1~4 SiC modules.

The 2FHC06M33XX integrates driver protection, intelligent fault management, distributed NTC sampling and other functions, and is suitable for multi- parallel connection of packages such as Infineon XHP_2, Mitsubishi LV100, Hitachi Linpak and so on. It is mainly used in PV, wind, rail and other high reliability fields.

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