Gate Driver Solution for Renewable Energy ED-WP-CB

The 2FHC06M33XX is a high-performance, dual-channel SiC/IGBT gate driver core based on Firstack intelligent chip technology, supports SiC/IGBT modules up to 3300V. It is composed of a MCC (main control core) and multiple MAB (module adaptor board) units. The MCC and MAB are connected by a set of cables, which can flexibly match 1 to 4 SiC/IGBT modules and has excellent current sharing effect. In addition, the 2FHC06M33XX features distributed NTC sampling, the temperature information of each paralleled module can be accurately read and transmitted to the customer through isolation, which greatly reduces the customer development cycle. It is suitable for Infineon XHP_2, Mitsubishi LV100, Hitachi Linpak and other packaging multi-parallel, and mainly used in rail, PV, wind, industrial drives and other high-reliability fields.

• Jitter time < 3ns
• 3300V X4
• VGS adjustable
• Isolated NTC sensing

• VDC : 20~6000V，Id/Ic =5~8000A
• LS＜10nH
• Temp：-45-200℃

The 1FSS0560 is designed for both welded and press-pack IGBT modules rated at 4500V/6500V. When connected with an adapter board via wiring harness, it forms a complete drive solution.
By pairing with various adapter boards, this product is compatible with multiple IGBT package types. Additionally, different wiring harness lengths can be selected to flexibly adapt to complex application scenarios, meeting diverse usage requirements.

Highlights：
● 5W/60A per channel

● OC&di/dt protection

● Compatible with multiple IGBT package

● Up to 6500V module

Applications：

● Grid

● Rail

Based on over a decade of research in gate drivers and power modules, Firstack is able to offer customized power module solutions for our clients. We can design the overall mechanical structure of the module according to your specific requirements, including the connections for capacitors and busbars, as well as the heat sink and AC-side output terminals. Our core advantage lies in the seamless integration of power modules and gate drivers, saving you the step of troubleshooting and optimization. This provides a solid foundation to ensure the stable and efficient operation of the entire system.

The 2FHC06M33XX is a high-performance, dual-channel SiC/IGBT gate driver core based on Firstack intelligent chip technology, supports SiC/IGBT modules up to 3300V. It is composed of a MCC (main control core) and multiple MAB (module adaptor board) units. The MCC and MAB are connected by a set of cables, which can flexibly match 1 to 4 SiC/IGBT modules and has excellent current sharing effect. In addition, the 2FHC06M33XX features distributed NTC sampling, the temperature information of each paralleled module can be accurately read and transmitted to the customer through isolation, which greatly reduces the customer development cycle. It is suitable for Infineon XHP_2, Mitsubishi LV100, Hitachi Linpak and other packaging multi-parallel, and mainly used in rail, PV, wind, industrial drives and other high-reliability fields.

• Jitter time < 3ns
• 3300V X4
• VGS adjustable
• Isolated NTC sensing

• VDC : 20~6000V，Id/Ic =5~8000A
• LS＜10nH
• Temp：-45-200℃

The 1FSS0560 is designed for both welded and press-pack IGBT modules rated at 4500V/6500V. When connected with an adapter board via wiring harness, it forms a complete drive solution.
By pairing with various adapter boards, this product is compatible with multiple IGBT package types. Additionally, different wiring harness lengths can be selected to flexibly adapt to complex application scenarios, meeting diverse usage requirements.

Highlights：
● 5W/60A per channel

● OC&di/dt protection

● Compatible with multiple IGBT package

● Up to 6500V module

Applications：

● Grid

● Rail