One-Component Epoxies – Simplified Handling, Reduced Risk
SpeedPox exclusively offers single-component systems. Mixing errors, pot-life concerns, and dosing deviations are eliminated. This reduces handling complexity and increases reproducibility — especially valuable in high-throughput or automated lines.
Trigger-On-Demand Curing for Maximum Control
- Heat-Cure: Curing starts immediately above ~120 °C, allowing integration into existing thermal processes. This enables sub-minute cure times and significant energy savings.
- UV-Cure: Activated instantly via UV impulse — ideal for hybrid assemblies requiring precision and spatial control.
Both systems provide high process control, minimal thermal exposure, and improved takt-time efficiency.
Reliable Material Performance
All SpeedPox formulations offer excellent dielectric properties, thermal resistance, and environmental durability. They are suitable for:
- Potting and encapsulation (transformers, connectors, wire bonds)
- Electrically conductive bonding (ICs, PCBs, printed electronics)
- Microelectronic and sensor integration
- In-Mold-Electronics
Validated Integration Support
SpeedPox supports customers through feasibility analysis, prototype testing, and production integration — ensuring optimal alignment between material, process, and application.
Contact
office@speedpox.com
speedpox.com
Holz-Steiner Straße 6/4a
2201 Gerasdorf bei Wien
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