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Materials Technologies Enabling the Next-Generation of Power Distribution for AI Data Center Infrastructure

10 Jun 2026

Speakers:
Andreas Karch, Regional Technical Manager, Indium Corporation
Syeda Qurat ul ain Akbar, Senior Staff Product Applications Engineer, Infineon Technologies

As power devices trend toward reduced size and higher output seeking better efficiency, this session will highlight new materials solutions offering robust performance, including Copper Sintering, reinforced solder preforms, and reliability-enhancing alloy technologies.

More about the person

Andreas Karch

Andreas Karch

Regional Technical Manager, Indium Corporation

Andreas Karch, Regional Technical Manager and Technologist – Advanced Applications, provides technical support, including sharing process knowledge and making technical recommendations for the use of Indium Corporation’s materials for customers in Germany, Austria, and Switzerland. Products include solder paste, solder preforms, fluxes, and thermal management materials.

Syeda Qurat ul ain Akbar

Syeda Qurat ul ain Akbar

Senior Staff Product Applications Engineer, Infineon Technologies

Qurat ul ain is a product application engineer for discrete IGBTs and diodes, supporting home appliance market in power factor correction topologies, at Infineon Technologies AG, Austria. She holds a master's degree in power engineering from Technical University of Munich and a bachelor's in electrical engineering from Lahore University of Management Sciences, Pakistan.

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