Thermal Management Innovations for High-Power Applications in E-Mobility

As the power density of semiconductor chips continues to rise, conventional thermal management materials and processes face three major challenges: thermal conductivity, thermal expansion matching, and the fabrication of complex structures. This report focuses on three advanced thermal materials—high-volume-fraction AlSiC, diamond‑copper composites, and 3D‑printed copper—combined with three core processes: pressure infiltration, counter-pressure casting, and additive manufacturing (3D printing). Furthermore, it introduces a design methodology driven by multiphysics simulation, artificial intelligence (AI), and mould flow analysis to systematically explore high‑efficiency thermal management solutions for next‑generation chips and power modules.