Gen 4 SiC Devices in Embedded module design - the path to higher power density and cost-efficiency

Silicon (Si) power devices are reaching their limits, making Silicon Carbide (SiC) essential for next-generation power electronics. However, traditional wire-bonded packaging creates parasitic limitations that restrict SiC performance.

This presentation explores embedded packaging as a disruptive approach for two key markets: automotive traction inverters and AI data centers (AIDC).

For automotive applications, embedded packaging reduces system size and improves thermal reliability under harsh cycling conditions. For AIDC, it enables ultra-efficient, high-density power systems supporting 800V HVDC architectures and >1 MHz switching frequencies, helping achieve efficiency targets of up to 98.5%.

The presentation highlights the benefits of embedding SiC dies, key manufacturing trade-offs, and future opportunities for this cross-industry packaging technology.