Silver-Free Substrates and Interconnects: Next-Gen Materials for Scalable Automotive Power Modules

Automotive power electronics are entering a pivotal transition as two forces reshape the industry: the rapid adoption of SiC power semiconductors and rising volatility in raw-material markets, especially silver. High switching speeds and elevated temperatures place extreme demands on substrates and interconnects, making high-performance AMB solutions a structural requirement for automotive-grade SiC modules. At the same time, the strong dependence on silver creates price instability and procurement risks. Heraeus Electronics is developing silver-reduced and silver-free materials across the interconnect chain: next-generation silver-free AMB substrates Condura®.ultra, silver-reduced solder pastes such as Innolot®, and copper-based sinter pastes in advanced development. This presentation shows why reducing silver is a strategic necessity—and why these materials represent the next-generation standard for predictable, scalable, future-ready power-module manufacturing.